IPC是指IPC协会,A是指Application,610是指序列号,E是指版本
如果你要做IPC培训你可以去拓普达资讯有限公司
IPC培训中的IPC-A-610E(电子组件的可接受性要求)培训J-STD-001E(电气与电子组件的焊接要求)培训IPC-7711/21B(电子组件和电路板的返工&返修)培训IPC-A-600H (印制板的验收条件)培训IPC-A-620A (电缆、线束装配的技术条件及验收要求) 培训拓普达公司的康老师都能讲,他是IPC亚洲区技术委员会工作小组主席,很了不起的哦 !!!
关于IPC-A-610E标准的内容:
模块一 ﹡概述/如何建立和保持认证课程政策和程序/Summarize/policy and program。
(关于认证课程、证书的期限、参与者的义务、IPC认证培训员、补考的政策等/About authentication course\ Time limit of the certificate\ The participant's obligation etc.。)
模块二 ﹡前言、可适用文件、操作/Foreword/ Applicable Documents/ Handling Electronic Assemblies
(范围、目的、特殊设计、术语和定义、图例、检查方法、尺寸界定、放大装置和照明、适用文件、IPC文件、电子组件操作等。Scope/ Purpose/ Specialized Designs/ Terms & Defintions/ Examples and lllustrations/ Inspection Methodology/ Verification of Dimensions / Magnification Aid and Lighting/ IPC Documents/ Handling Electronic Assemblies etc. )
★ 模块三 ﹡机械装联/Hardware
(机械零件的安装、连接器、拔插件、手柄和插孔、连接器引脚、线束固定、布线等。Hardware Installation/ Connectors,Handles,Extractors,Latches/Connector Pins/ Wire Bundle Securing/Routing etc.)
模块四 ﹡焊接和高电压Soldering/ High Voltage
(焊接的可接受性、高压以及焊接异常等Soldering Acceptability Requirements/ Soldering Anomalies/ High Voltage—Terminals/Solder Cups/Insulation/Throgh-hole Connections/Flared Flange Terminals/Other Hardware.)
模块五 ﹡端子连接Terminal Connections (夹簧铆接端、铆接件、导线/引脚准备上锡、引脚成型-应力释放、维修环、应力释放引脚/导线弯曲、引脚/导线的安放、绝缘皮、导体、端子焊接、导体-损伤-焊后的情形等。Edge Clip/ Swaged Hardware/ Wire/lead Preparation-tining/Lead Forming-Stress Relief/Service loops/ Terminals-stress Relief lead/Wire Bend/ Lead/Wire Placement/Insulation/Conductor/Terminals-Solder/Conductor-Damage-Posrt-Solder)
模块六 ﹡通孔连接技术Througe-hole Technology(元气件安放、散热器、元气件紧固、支撑孔、非支撑孔、跨接线等。Component Mounting/ Heatsinks/ Component Securing / Unsupported Holes / Supported Holes / Jumper Wires.)
模块七 ﹡表面安装技术Surface Mount Assembiles
(胶水粘接、SMT连接(底部焊垫片式元件、1-3-5片式元件、圆拄型、城堡型、鸥翼型引脚、圆形或扁圆型引脚、J型、I型、扁平焊片、高立底部焊垫、内L型、BGA、PQFN等引脚形态)、跨接线等。Staking Adhesive / SMT Connections( Chip Componts-Bottom Only Terminations / Chip Components-Rectangular or Square End Components-1,3 or 5 Side Termination / Cylindrical End Cap(MELF) Termination / Castellated Terminations / Flat Ribbon, L, and Gull Wing Leads / Round or Flattened (coined) Leads / J leads / Butt/ I Connections / Flat Lug Leads / Tall Profile Components Having Bottom Only Terminations / Inward Formed L-Shaped Ribbon Leads / Surface Mount Area Array / Plastic Quad Flat Pack-No Leads(PQFN) / Components with Bottom Thermal Plane Terminations.) / Jumper Wires.)
模块八 *元件损伤和印制电路板及其组件Component Damage / Printed Circuit Boards and Assemblies
(印制电路板和组件(金手指、层压板状况、导体和焊盘、标记、清洁度、涂覆)、元件的损伤等。Component Damage / Printed Circuit Boards and Assemblies(Gold Fingers / Laminate Conditions / Marking / Cleanliness / Coatings ))
模块九 *分立连接导线的可接受性要求Discrete Wiring Acceptability Requirements
(无焊饶接、匝数、匝间隙、导线尾端/带绝缘段饶匝、线匝隆起、联接位置、埋线、饶线松紧度、镀层、绝缘皮损伤、导线和接线柱损伤等的判定。Solderless Wrap ( Number Wrap / Turn Spacing / End Tails,Insulation Wrap / Raised Tums Overlap / Connection Positon / Wire Dress / Wire Slack / Wire Plating / Damaged Insulation / Damaged Conductors & Terminals))
模块十 *考试Testing
(开卷和闭卷Open testing and Close testing.)
楼主:
IPC是指IPC协会,A是指Application,610是指序列号,E是指版本,他主要是讲以下内容:
IPC-A-610E电子组件的可接受性认证培训课程
主办单位:深圳市强博康资讯有限公司
培训日期:2011年7月21-23日(周四-周六) 培训地点:深圳
培训日期:2011年7月13-15日(周三-周五) 培训地点:上海
培训费用:3000元/人/3天 含光碟价:3800元
培训资料:IPC-A-610E中文标准(IPC出版)、IPC-A-610E学员手册(学员做笔记用)、《SMT工艺与设备》会刊、《电子组装技术》会刊
班级规模:为保证授课质量,IPC规定每班拿证人数不超过15人。
温馨提示:本课程每月将在全国各地举办公开课,也为企业提供企业内训,企业内训参加人数不受限制,培训内容可按企业需求进行节选,培训时间客户提出,请有需求的客户速致电本培训中心咨询!
课程内容:
模块一 ﹡概述/如何建立和保持认证课程政策和程序/Summarize/policy and program。
(关于认证课程、证书的期限、参与者的义务、IPC认证培训员、补考的政策等/About authentication course\ Time limit of the certificate\ The participant's obligation etc.。)
模块二 ﹡前言、可适用文件、操作/Foreword/ Applicable Documents/ Handling Electronic Assemblies
(范围、目的、特殊设计、术语和定义、图例、检查方法、尺寸界定、放大装置和照明、适用文件、IPC文件、电子组件操作等。Scope/ Purpose/ Specialized Designs/ Terms & Defintions/ Examples and lllustrations/ Inspection Methodology/ Verification of Dimensions / Magnification Aid and Lighting/ IPC Documents/ Handling Electronic Assemblies etc. )
★ 模块三 ﹡机械装联/Hardware
(机械零件的安装、连接器、拔插件、手柄和插孔、连接器引脚、线束固定、布线等。Hardware Installation/ Connectors,Handles,Extractors,Latches/Connector Pins/ Wire Bundle Securing/Routing etc.)
模块四 ﹡焊接和高电压Soldering/ High Voltage
(焊接的可接受性、高压以及焊接异常等Soldering Acceptability Requirements/ Soldering Anomalies/ High Voltage—Terminals/Solder Cups/Insulation/Throgh-hole Connections/Flared Flange Terminals/Other Hardware.)
模块五 ﹡端子连接Terminal Connections (夹簧铆接端、铆接件、导线/引脚准备上锡、引脚成型-应力释放、维修环、应力释放引脚/导线弯曲、引脚/导线的安放、绝缘皮、导体、端子焊接、导体-损伤-焊后的情形等。Edge Clip/ Swaged Hardware/ Wire/lead Preparation-tining/Lead Forming-Stress Relief/Service loops/ Terminals-stress Relief lead/Wire Bend/ Lead/Wire Placement/Insulation/Conductor/Terminals-Solder/Conductor-Damage-Posrt-Solder)
模块六 ﹡通孔连接技术Througe-hole Technology(元气件安放、散热器、元气件紧固、支撑孔、非支撑孔、跨接线等。Component Mounting/ Heatsinks/ Component Securing / Unsupported Holes / Supported Holes / Jumper Wires.)
模块七 ﹡表面安装技术Surface Mount Assembiles
(胶水粘接、SMT连接(底部焊垫片式元件、1-3-5片式元件、圆拄型、城堡型、鸥翼型引脚、圆形或扁圆型引脚、J型、I型、扁平焊片、高立底部焊垫、内L型、BGA、PQFN等引脚形态)、跨接线等。Staking Adhesive / SMT Connections( Chip Componts-Bottom Only Terminations / Chip Components-Rectangular or Square End Components-1,3 or 5 Side Termination / Cylindrical End Cap(MELF) Termination / Castellated Terminations / Flat Ribbon, L, and Gull Wing Leads / Round or Flattened (coined) Leads / J leads / Butt/ I Connections / Flat Lug Leads / Tall Profile Components Having Bottom Only Terminations / Inward Formed L-Shaped Ribbon Leads / Surface Mount Area Array / Plastic Quad Flat Pack-No Leads(PQFN) / Components with Bottom Thermal Plane Terminations.) / Jumper Wires.)
模块八 *元件损伤和印制电路板及其组件Component Damage / Printed Circuit Boards and Assemblies
(印制电路板和组件(金手指、层压板状况、导体和焊盘、标记、清洁度、涂覆)、元件的损伤等。Component Damage / Printed Circuit Boards and Assemblies(Gold Fingers / Laminate Conditions / Marking / Cleanliness / Coatings ))
模块九 *分立连接导线的可接受性要求Discrete Wiring Acceptability Requirements
(无焊饶接、匝数、匝间隙、导线尾端/带绝缘段饶匝、线匝隆起、联接位置、埋线、饶线松紧度、镀层、绝缘皮损伤、导线和接线柱损伤等的判定。Solderless Wrap ( Number Wrap / Turn Spacing / End Tails,Insulation Wrap / Raised Tums Overlap / Connection Positon / Wire Dress / Wire Slack / Wire Plating / Damaged Insulation / Damaged Conductors & Terminals))
模块十 *考试Testing
(开卷和闭卷Open testing and Close testing.)
1957年9月,六家印制板企业建立了“印制电路协会”,
英文为Institute of printed circuits,简称IPC。
后来由于成员增加,涉及范围扩大,因而于1977年
改名为The Institute for Interconnecting and Packaging
Electronic Circuits,即“电子电路互连与封装协会”。
1998年,再次改名为Association Connecting
Electronics Industries,(电子工业联接协会),但简称一
直不变。
上次在Q-Bulk培训时,老师这么说的