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(1)LCP型激光器适合大厚度材料的快速切割，切割效率高、切缝窄、切割热损伤远低于其他厂家的同类产品。

The LCP laser suits the great thickness material fast cutting, The cutting efficiency high, the kerf narrow, the cutting pyrolytic damage is lower than other factories far the similar product.

其单面切割深度可达到6mm以上，

Its one-sided cutting depth may achieve above 6mm,

双面切割厚度可达10mm以上，

Two-sided cutting thickness may reach above 10mm,

对于厚度2mm以内的超硬材料，

Regarding thickness 2mm in ultra hard material,

其切割速度可达每分钟60mm以上，

Its cutting speed may reach above each minute 60mm,

切缝宽度0.1mm左右，

About kerf width 0.1mm,

是目前PCD、PCBN、CVDD、超硬陶瓷等材料切割的主流产品。

Is material cutting and so on present PCD, PCBN, CVDD, ultra hard ceramics mainstream products.

（2）LCM是新开发的一种纳秒巨脉冲激光机型，

LCM is the new development one kind of nanosecond great pulse laser type,

其性能兼具LCP和LCQ的优点，

Its performance concurrently LCP and LCQ merit,

不仅可用于4.0mm厚度以内的各种金刚石、立方氮化硼等超硬材料的快速精细切割，

Not only available in 4.0mm thickness each kind of diamond, cubic boron nitride and so on ultra hard material fast fine cutting,

更具有同LCQ型一样的高切割品质，

Has with the LCQ same high cutting quality,

对材料的热冲击损伤远远小于LCP型。

Is smaller than by far to the material thermal shock damage LCP.

（3）LCM型激光器很好地解决了单晶金刚石、CVD金刚石及低浓度PCBN材料在使用LCP型激光切割时易受损伤及LCQ型激光切割时效率过低、难以切深的问题。

The LCM laser has solved the unit crystal diamond, the CVD diamond and the low concentration PCBN material well when uses LCP laser cutting damages and when LCQ laser cutting the efficiency excessively is been easily low, cuts with difficulty the deep question.

（1）LCP型激光器适合大厚度材料的快速切割，切割效率高、切缝窄、切割热损伤远低于其他厂家的同类产品。其单面切割深度可达到6mm以上，双面切割厚度可达10mm以上，对于厚度2mm以内的超硬材料，其切割速度可达每分钟60mm以上，切缝宽度0.1mm左右，是目前PCD、PCBN、CVDD、超硬陶瓷等材料切割的主流产品。

（2）LCM是新开发的一种纳秒巨脉冲激光机型，其性能兼具LCP和LCQ的优点，不仅可用于4.0mm厚度以内的各种金刚石、立方氮化硼等超硬材料的快速精细切割，更具有同LCQ型一样的高切割品质，对材料的热冲击损伤远远小于LCP型。

（3）LCM型激光器很好地解决了单晶金刚石、CVD金刚石及低浓度PCBN材料在使用LCP型激光切割时易受损伤及LCQ型激光切割时效率过低、难以切深的问题。

(1)LCP laser machine is suitable for the fast cutting of materials of great thickness. It has great cutting efficiency, thin cutting gap and its cutting heat damage is far lower than other manufacturers' similar products. Its one side cutting depth can reach more than 6mm, and the two side cutting thickness can reach more than 10mm. For super-hard materials with the thickness within 2mm, its cutting speed can be up to 60mm/minute, and the cutting gap width is about 0.1mm. It is the popular product for the cutting of PCD, PCBN, CVDD, super-hard ceramics.

(2)LCM is a newly developed nanosecond giant impulse laser machine, and it has the advantages of both LCP and LCQ. It cannot only cut all kinds of diamonds, CBN quickly and precisely, but also has the high cutting quality like LCQ, and its cutting heat damage is much lower than LCP type.

(3) LCM laser machine solved the problems that for single crystal diamond, CVD diamond and low concentration PCBN materials, the LCP laser machine would cause damage and the LCQ has low cutting efficiency.

1)LCP laser machine is suitable for the fast cutting of materials of great thickness. It has great cutting efficiency, thin cutting gap and its cutting heat damage is far lower than other manufacturers' similar products. Its one side cutting depth can reach more than 6mm, and the two side cutting thickness can reach more than 10mm. For super-hard materials with the thickness within 2mm, its cutting speed can be up to 60mm/minute, and the cutting gap width is about 0.1mm. It is the popular product for the cutting of PCD, PCBN, CVDD, super-hard ceramics.

(2)LCM is a newly developed nanosecond giant impulse laser machine, and it has the advantages of both LCP and LCQ. It cannot only cut all kinds of diamonds, CBN quickly and precisely, but also has the high cutting quality like LCQ, and its cutting heat damage is much lower than LCP type.

(3) LCM laser machine solved the problems that for single crystal diamond, CVD diamond and low concentration PCBN materials, the LCP laser machine would cause damage and the LCQ has low cutting efficiency.

1The LCP type laser device is suitable to big thickness material fleetness cutting , the efficient , eager crack of cutting is narrow , hot loss of cutting is way below other the same kind of manufacturer product. Whose single face cutting depth may reach 6 mms the above, two-sided cutting thickness may reach more than 10 mms, hard to thickness being over within 2 mms material, whose cutting speed may reach 60 mms per minute the above, cut material such as sewing the width 0.1 mm retinue , being that PCD , PCBN , CVDD, surpass hard ceramics at present the cutting main current product.
2LCM is newly developed one kind of huge pulse laser of Nanosecond model , whose function is utensil LCP and the LCQ merit concurrently, not only may be used for the rapidly meticulous cutting surpassing hard material such as various miamond , cube nitriding boron within 4.0 mm thickness, more have same LCQ type-like high cutting quality, the heat to material pounds injuring the type being smaller than LCP over.
连3我也顺便翻了吧
3When single crystal miamond , CVD miamond and low thickness PCBN material the LCM type laser device has been resolved very good are when using the LCP type laser cutting easy to suffer loss and the LCQ type laser cutting, efficiency cuts the deep problem too low , difficult to.

(1)LCP type the big thickness material with in keeping with laser machine incises quickly, incising an efficiency high,slice to sew narrow,incise the same kind product that the heat hurts the away below and other factory house.Its one side's incising depth can attain a 6 mms above, two-sided incise thickness and can reach to a 10 mms above, for thickness the super and hard material within 2 mms, its incising speed can reach every minute a 60 mms above, slicing to sew the width 0.1 mms or so, is the essential product that the PCD,PCBN,CVDD,super and hard porcelain and ceramics etc. material incises currently.

(2)The The LCM is a kind of 纳 second huge pulse laser model of the new development, the its function the and have the the advantage the of the the LCP and LCQ, the not only the can used the for the 4.0 mm the thickness in the of various diamond, sign square nitrogen to turn etc. the fast fine of the super and hard material incise, more have a LCQ type is similar and high to incise quality together, hurt to the hot impact of the material far and far small in LCP type.

(3)LCM type the laser machine resolved the single diamond,the CVD diamond and the low density PCBN material nicely while using a laser to incise the easily damaged wound and LCQ type laser incised the time limited efficacy rate to lead low and hard slice a deep problem.

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（1）LCP型激光器适合大厚度材料的快速切割，切割效率高、切缝窄、切割热损伤远低于其他厂家的同类产品。其单面切割深度可达到6mm以上，双面切割厚度可达10mm以上，对于厚度2mm以内的超硬材料，其切割速度可达每分钟60mm以上，切缝宽度0.1mm左右，是目前PCD、PCBN、CVDD、超硬陶瓷等材料切割的主流产品。

（2）LCM是新开发的一种纳秒巨脉冲激光机型，其性能兼具LCP和LCQ的优点，不仅可用于4.0mm厚度以内的各种金刚石、立方氮化硼等超硬材料的快速精细切割，更具有同LCQ型一样的高切割品质，对材料的热冲击损伤远远小于LCP型。

（3）LCM型激光器很好地解决了单晶金刚石、CVD金刚石及低浓度PCBN材料在使用LCP型激光切割时易受损伤及LCQ型激光切割时效率过低、难以切深的问题。
(1) the LCP laser suits the great thickness material fast to cut, cutsthe efficiency high, 切缝 is narrow, cuts the pyrolytic damage farto be lower than other factories the similar product. It one-sidedcuts the depth to be possible to achieve above 6mm, two-sided cutsthickness to be possible to reach above 10mm, regarding the thickness2mm in ultra hard material, it cuts the speed to be possible to reachabove each minute 60mm, 切缝 about width 0.1mm, is the mainstreamproduct which material and so on present PCD, PCBN, CVDD, ultra hardceramics cuts.

(2) LCM is the new development one kind of nanosecond great pulselaser type, its performance concurrently LCP and LCQ merit, not onlymay use in 4.0mm thickness each kind of diamond, the cubic boronnitride and so on the ultra hard material fast fine cuts, has with LCQis same high cuts the quality, is smaller than by far to the materialthermal shock damage LCP.

(3) the LCM laser has solved the unit crystal diamond, the CVD diamondand the low density PCBN material well when uses the LCP laser cutseasily is damaged and the LCQ laser cuts the effectiveness for aperiod of time to lead to be low, to cut with difficulty the deepquestion.