Heatsink Small Out-Line Package （带散热片的小尺寸封装）
HSOP is a surface mount package with ìgull wingî lead form.This package has
a mechanically attached thick Copper (Cu) heat slug to improve the thermal performance.The
exposed heat slug provides a direct path for heat conduction awayfrom an IC and into a solder
attached Printed Circuit Board (PCB).
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