哪位好心人能把下面的这段文章翻译一下啊，小弟不胜感激

Plate a bore manufacturing process
Manufacturing process elucidation
Conjunction layer the copper circuit of.
Work contents
After drilling a hole completion, layer the electric circuit of didn't lead, so have to become 1 layer to lead a layer on the bore wall, by with connect circuit, this process general industry is called a PTH manufacturing process, main of work the procedure include to clean a gum residue, chemistry copper with electroplate a copper three procedures.In the aspects of going to a gum residue, main purpose is drill a hole for the sake of the clearance in produce of remnant possibility to the harassment that the internal circuit results in.Chemistry copper aspect, the main purpose is sweeping of the bore wall surface formation lead the copper thin film of, urging circuit board to in follow-uply electroplate the procedure conduct electricity dint goodly, also having part of manufactories to use other conductors recently, such as:Graphite or conduct electricity high mark son's conduct and actions to lie quality to make again to electroplate, such as:The SHADOW is the nonmetal conductor manufacturing process of graphite type, practical have already had a quite good performance up, this type of manufacturing process is called "electroplate directly".The whole plankses electroplate then for thickening the method that the copper thickness in the bore adopts, from the circuit of circuit board surface hasn't become at this time, so this kind of procedure is called "the whole plankses electroplate"

直接用金山快意选重文字点(译中文)即可Plate a bore manufacturing process
Manufacturing process elucidation
Conjunction layer the copper circuit of.
Work contents
After drilling a hole completion, layer the electric circuit of didn't lead, so have to become 1 layer to lead a layer on the bore wall, by with connect circuit, this process general industry is called a PTH manufacturing process, main of work the procedure include to clean a gum residue, chemistry copper with electroplate a copper three procedures.In the aspects of going to a gum residue, main purpose is drill a hole for the sake of the clearance in produce of remnant possibility to the harassment that the internal circuit results in.Chemistry copper aspect, the main purpose is sweeping of the bore wall surface formation lead the copper thin film of, urging circuit board to in follow-uply electroplate the procedure conduct electricity dint goodly, also having part of manufactories to use other conductors recently, such as:Graphite or conduct electricity high mark son's conduct and actions to lie quality to make again to electroplate, such as:The SHADOW is the nonmetal conductor manufacturing process of graphite type, practical have already had a quite good performance up, this type of manufacturing process is called "electroplate directly".The whole plankses electroplate then for thickening the method that the copper thickness in the bore adopts, from the circuit of circuit board surface hasn't become at this time, so this kind of procedure is called "the whole plankses electroplate" Plate a bore manufacturing process
Manufacturing process elucidation
Conjunction layer the copper circuit of.
Work contents
After drilling a hole completion, layer the electric circuit of didn't lead, so have to become 1 layer to lead a layer on the bore wall, by with connect circuit, this process general industry is called a PTH manufacturing process, main of work the procedure include to clean a gum residue, chemistry copper with electroplate a copper three procedures.In the aspects of going to a gum residue, main purpose is drill a hole for the sake of the clearance in produce of remnant possibility to the harassment that the internal circuit results in.Chemistry copper aspect, the main purpose is sweeping of the bore wall surface formation lead the copper thin film of, urging circuit board to in follow-uply electroplate the procedure conduct electricity dint goodly, also having part of manufactories to use other conductors recently, such as:Graphite or conduct electricity high mark son's conduct and actions to lie quality to make again to electroplate, such as:The SHADOW is the nonmetal conductor manufacturing process of graphite type, practical have already had a quite good performance up, this type of manufacturing process is called "electroplate directly".The whole plankses electroplate then for thickening the method that the copper thickness in the bore adopts, from the circuit of circuit board surface hasn't become at this time, so this kind of procedure is called "the whole plankses electroplate"

太专业了